DataSheet8.cn


PDF ( 数据手册 , 数据表 ) BCP51

零件编号 BCP51
描述 PNP medium power transistors
制造商 NXP Semiconductors
LOGO NXP Semiconductors LOGO 


1 Page

No Preview Available !

BCP51 数据手册, 描述, 功能
BCP51; BCX51; BC51PA
45 V, 1 A PNP medium power transistors
Rev. 9 — 13 October 2011
Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number[1]
Package
NXP
BCP51
SOT223
BCX51
SOT89
BC51PA
SOT1061
JEITA
SC-73
SC-62
-
[1] Valid for all available selection groups.
JEDEC
-
TO-243
-
NPN complement
BCP54
BCX54
BC54PA
1.2 Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plastic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
High-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2.
Symbol
VCEO
IC
ICM
Quick reference data
Parameter
Conditions
collector-emitter voltage open base
collector current
peak collector current single pulse; tp 1 ms
Min Typ Max Unit
- - 45 V
- - 1 A
- - 2 A







BCP51 pdf, 数据表
NXP Semiconductors
BCP51; BCX51; BC51PA
45 V, 1 A PNP medium power transistors
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
1
0
0.02
0.01
006aac679
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
Fig 6.
FR4 PCB, mounting pad for collector 6 cm2
Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223;
typical values
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
10
006aac680
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
Fig 7.
FR4 PCB, standard footprint
Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;
typical values
BCP51_BCX51_BC51PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 13 October 2011
© NXP B.V. 2011. All rights reserved.
8 of 22







BCP51 equivalent, schematic
NXP Semiconductors
11. Soldering
BCP51; BCX51; BC51PA
45 V, 1 A PNP medium power transistors
1.3 1.2
(4×) (4×)
7
3.85
3.6
3.5
0.3
4
3.9 6.1 7.65
1 23
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
2.3
1.2
(3×)
1.3
(3×)
6.15
2.3
Fig 22. Reflow soldering footprint SOT223 (SC-73)
8.9
6.7
BCP51_BCX51_BC51PA
Product data sheet
1.9
4
6.2 8.7
1 23
1.9
(3×)
2.7 2.7
1.1
1.9
(2×)
Fig 23. Wave soldering footprint SOT223 (SC-73)
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 13 October 2011
sot223_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot223_fw
© NXP B.V. 2011. All rights reserved.
16 of 22










页数 22 页
下载[ BCP51.PDF 数据手册 ]


分享链接

Link :

推荐数据表

零件编号描述制造商
BCP51PNP medium power transistorsNXP Semiconductors
NXP Semiconductors
BCP51PNP Silicon AF Transistors (For AF driver and output stages High collector current)Siemens Semiconductor Group
Siemens Semiconductor Group
BCP51PNP Silicon AF TransistorsInfineon Technologies AG
Infineon Technologies AG
BCP51Surface mount Si-Epitaxial PlanarTransistorsDiotec Semiconductor
Diotec Semiconductor

零件编号描述制造商
STK15C88256-Kbit (32 K x 8) PowerStore nvSRAMCypress Semiconductor
Cypress Semiconductor
NJM4556DUAL HIGH CURRENT OPERATIONAL AMPLIFIERNew Japan Radio
New Japan Radio
EL1118-G5 PIN LONG CREEPAGE SOP PHOTOTRANSISTOR PHOTOCOUPLEREverlight
Everlight


DataSheet8.cn    |   2020   |  联系我们   |   搜索  |  Simemap