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零件编号 | BCP55 | ||
描述 | NPN medium power transistors | ||
制造商 | NXP Semiconductors | ||
LOGO | |||
1 Page
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
Rev. 8 — 24 October 2011
Product data sheet
1. Product profile
1.1 General description
NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number[1]
Package
NXP
BCP55
SOT223
BCX55
SOT89
BC55PA
SOT1061
JEITA
SC-73
SC-62
-
[1] Valid for all available selection groups.
JEDEC
-
TO-243
-
PNP complement
BCP52
BCX52
BC52PA
1.2 Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plastic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
Low-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2. Quick reference data
Symbol Parameter
Conditions
Min Typ Max Unit
VCEO
IC
ICM
hFE
collector-emitter voltage
collector current
peak collector current
DC current gain
hFE selection -10
hFE selection -16
open base
single pulse; tp 1 ms
VCE = 2 V; IC = 150 mA
VCE = 2 V; IC = 150 mA
VCE = 2 V; IC = 150 mA
-
-
-
[1] 63
[1] 63
[1] 100
-
-
-
-
-
-
60 V
1A
2A
250
160
250
[1] Pulse test: tp 300 s; = 0.02.
NXP Semiconductors
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
1
0
0.02
0.01
006aac679
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
Fig 6.
FR4 PCB, mounting pad for collector 6 cm2
Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223;
typical values
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
10
006aac680
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
Fig 7.
FR4 PCB, standard footprint
Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;
typical values
BCP55_BCX55_BC55PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 24 October 2011
© NXP B.V. 2011. All rights reserved.
8 of 22
NXP Semiconductors
11. Soldering
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
1.3 1.2
(4×) (4×)
7
3.85
3.6
3.5
0.3
4
3.9 6.1 7.65
1 23
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
2.3
1.2
(3×)
1.3
(3×)
6.15
2.3
Fig 22. Reflow soldering footprint SOT223 (SC-73)
8.9
6.7
BCP55_BCX55_BC55PA
Product data sheet
1.9
4
6.2 8.7
1 23
1.9
(3×)
2.7 2.7
1.1
1.9
(2×)
Fig 23. Wave soldering footprint SOT223 (SC-73)
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 24 October 2011
sot223_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot223_fw
© NXP B.V. 2011. All rights reserved.
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页数 | 22 页 | ||
下载 | [ BCP55.PDF 数据手册 ] |
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