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零件编号 | FGA6560WDF | ||
描述 | IGBT | ||
制造商 | Fairchild Semiconductor | ||
LOGO | |||
1 Page
FGA6560WDF
650 V, 60 A Field Stop Trench IGBT
April 2015
Features
• Maximum Junction Temperature : TJ =175oC
• Positive Temperaure Co-efficient for Easy Parallel Operating
• High Current Capability
• Low Saturation Voltage: VCE(sat) =1.8 V(Typ.) @ IC = 60 A
• 100% of the Parts Tested for ILM(1)
• High Input Impedance
• Fast Switching
• RoHS Compliant
General Description
Using novel field stop IGBT technology, Fairchild’s new series of
field stop 3rd generation IGBTs offer the optimum performance
for welder and industrial applications where low conduction and
switching losses are essential.
Applications
• Welder and Industrial Application
• Power Factor Correction
G
C
E
TO-3PN
Absolute Maximum Ratings
Symbol
VCES
VGES
IC
ILM (1)
ICM (2)
IF
IFM (2)
PD
TJ
Tstg
TL
Description
Collector to Emitter Voltage
Gate to Emitter Voltage
Transient Gate to Emitter Voltage
Collector Current
Collector Current
Pulsed Collector Current
@ TC = 25oC
@ TC = 100oC
@ TC = 25oC
Pulsed Collector Current
Diode Forward Current
Diode Forward Current
@ TC = 25oC
@ TC = 100oC
Pulsed Diode Maximum Forward Current
Maximum Power Dissipation
Maximum Power Dissipation
@ TC = 25oC
@ TC = 100oC
Operating Junction Temperature
Storage Temperature Range
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
Notes:
1. VCC = 400 V, VGE = 15 V, IC =180 A, RG = 62 Inductive Load
2. Repetitive rating: Pulse width limited by max. junction temperature
©2015 Fairchild Semiconductor Corporation
FGA6560WDF Rev. 1.1
1
C
G
E
FGA6560WDF
650
20
30
120
60
180
180
60
30
120
306
153
-55 to +175
-55 to +175
300
Unit
V
V
V
A
A
A
A
A
A
A
W
W
oC
oC
oC
www.fairchildsemi.com
5.20
4.80
20.10
19.70
16.20
15.40
R0.50
18.90
18.50
3°
1.85
2.20
1.80
1.20
0.80
0.55 M
1
3°
3
3.70
2.00
1.60
3.30
3.20
2.80
5.45
5.45
R0.50
5.00
4.60
1.65
1.45
13.80
13.40
3.30
3.10
16.96
16.56
4°
2.60
2.20
20.30
19.70
7.20
6.80
0.75
0.55
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO EIAJ
SC-65 PACKAGING STANDARD.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSION AND TOLERANCING PER
ASME14.5-2009.
D) DIMENSIONS ARE EXCLUSSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSSIONS.
E) DRAWING FILE NAME: TO3PN03AREV2.
F) FAIRCHILD SEMICONDUCTOR.
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页数 | 9 页 | ||
下载 | [ FGA6560WDF.PDF 数据手册 ] |
零件编号 | 描述 | 制造商 |
FGA6560WDF | IGBT | Fairchild Semiconductor |
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