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PDF ( 数据手册 , 数据表 ) IAB110P

零件编号 IAB110P
描述 Integrated Telecom Circuits
制造商 IXYS
LOGO IXYS LOGO 


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IAB110P 数据手册, 描述, 功能
INTEGRATED CIRCUITS DIVISION
IAB110P
Integrated Telecom Circuits
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
350
100
35
Units
VP
mArms / mADC
Features
3750Vrms Input/Output Isolation
Three Functions in One Package
Bidirectional Current Sensing
Bidirectional Current Switching
FCC Compatible
No EMI/RFI Generation
Small 16-Pin SOIC Package (PCMCIA Compatible)
Machine Insertable, Wave Solderable
Tape & Reel Versions Available
Applications
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Hook Switch
Dial Pulsing
Ground Start
Ringer Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Description
The IAB110P Multifunction Telecom switch combines
one 350V single-pole, normally open (1-Form-A)
relay; one 350V single-pole, normally closed
(1-Form-B) relay; and one bidirectional optocoupler in
a single package. Optically coupled relay outputs that
use the patented OptoMOS architecture are
controlled by a highly efficient GaAIAs infrared LED.
The IAB110P allows telecom circuit designers to
combine three discrete functions in a single
component, whose small package uses less space
than traditional discrete component solutions.
Approvals
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1305490
EN/IEC 60950-1 Certified Component:
TUV Certificate: B 09 07 49410 006
Ordering Information
Part #
IAB110P
IAB110PTR
Description
16-Pin SOIC (50/Tube)
16-Pin SOIC (1000/Reel)
Pin Configuration
1
(N/C)
2
3
4
5
6
7
8
(N/C)
16
15 (Form A)
14
13
12 (Form B)
11
10
9
1. (N/C)
2. + LED - Form A Relay #1
3. – LED - Form A Relay #1
4. + LED - Form B Relay #2
5. – LED - Form B Relay #2
6. Emitter - Phototransistor
7. Collector - Phototransistor
8. (N/C)
9. LED - Phototransistor +/–
10. LED - Phototransistor –/+
11. Output - Form B Relay #2
12. Common Source Relay #2
13. Output - Form B Relay #2
14. Output - Form A Relay #1
15. Common Source Relay #1
16. Output - Form A Relay #1
Pb
DS-IAB110P-R04
e3
Switching Characteristics of
Normally Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
Switching Characteristics of
Normally Closed Devices
Form-B
IF
ILOAD
10%
toff
90%
ton
www.ixysic.com
1







IAB110P pdf, 数据表
INTEGRATED CIRCUITS DIVISION
IAB110P
IAB110P
PIN 16
PIN 1
10.160±0.381
(0.400±0.015)
MECHANICAL DIMENSIONS
10.363±0.127
(0.408±0.005)
7.493±0.127
(0.295±0.005)
0.635 X 45°
(0.025 X 45°)
0.254 ±0.0127
(0.010±0.0005)
PCB Land Pattern
1.016 TYP
(0.040 TYP)
1.90
(0.075)
9.30
(0.366)
1.270 TYP
(0.050 TYP)
0.406 TYP
(0.016 TYP)
8.890 TYP
(0.350 TYP)
0.508±0.1016
(0.020±0.004)
2.108 MAX
(0.083 MAX)
See Note 3
Lead to Package Standoff:
MIN: 0.0254 (0.001)
MAX: 0.102 (0.004)
1.27
(0.050)
0.60
(0.024)
DIMENSIONS
mm
(inches)
NOTES:
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating
(1000 microinch maximum).
3. Sum of package height, standoff, and coplanarity
does not exceed 2.108 (0.083).
IAB110PTR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossed Carrier
Embossment
B0=10.70
(0.421)
K0=3.20
(0.126)
K1=2.70
(0.106)
A0=10.90
(0.429)
P=12.00
(0.472)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
W=16
(0.630)
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IAB110P-R04
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
8 12/19/2012














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