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PDF ( 数据手册 , 数据表 ) MTB090N06I3

零件编号 MTB090N06I3
描述 N-Channel Enhancement Mode Power MOSFET
制造商 CYStech Electronics
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MTB090N06I3 数据手册, 描述, 功能
CYStech Electronics Corp.
Spec. No. : C420I3
Issued Date : 2014.07.11
Revised Date :
Page No. : 1/8
N-Channel Enhancement Mode Power MOSFET
MTB090N06I3 BVDSS
ID@VGS=10V
RDSON(TYP)
VGS=10V, ID=3A
VGS=4.5V, ID=2A
60V
5A
70mΩ
82mΩ
Features
Low On Resistance
Simple Drive Requirement
Low Gate Charge
Fast Switching Characteristic
Pb-free lead plating and halogen-free package
Symbol
MTB090N06I3
Outline
TO-251
GGate DDrain SSource
G DS
Ordering Information
Device
MTB090N06I3-0-UJ-G
Package
Shipping
TO-251
(Pb-free lead plating and halogen-free package)
80 pcs/tube, 100 tubes/box
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec,UJ : 80 pcs / tube, 100 tubes/box
Product rank, zero for no rank products
Product name
MTB090N06I3
CYStek Product Specification







MTB090N06I3 pdf, 数据表
CYStech Electronics Corp.
TO-251 Dimension
Spec. No. : C420I3
Issued Date : 2014.07.11
Revised Date :
Page No. : 8/8
Marking:
Product
Name
Date
Code
B090
N06
□□□□
Style: Pin 1.Gate 2.Drain 3.Source
3-Lead TO-251 Plastic Package
CYStek Package Code: I3
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.2500 0.2677 6.35
6.80
B 0.2047 0.2165 5.20
5.50
C 0.5512 0.5906 14.00 15.00
D 0.0236 0.0354 0.60
0.90
E 0.0199 0.0276 0.50
0.70
F 0.0886 0.0925 2.25
2.35
G 0.0886 0.0925 2.25
2.35
H 0.0169 0.0236 0.43
0.60
DIM
Inches
Min. Max.
I 0.0866 0.0945
J 0.2126 0.2283
K 0.2835 0.3071
L 0.0354 0.0591
M 0.0169 0.0236
N 0.1181 REF
S 0.1969 REF
T 0.1496 REF
Millimeters
Min. Max.
2.20 2.40
5.40 5.80
7.20 7.80
0.90 1.50
0.43 0.60
3.00 REF
5.00 REF
3.80 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB090N06I3
CYStek Product Specification














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