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零件编号 | IRFWZ24 | ||
描述 | Power MOSFET ( Transistor ) | ||
制造商 | Fairchild Semiconductor | ||
LOGO | |||
1 Page
Advanced Power MOSFET
IRFWZ24
FEATURES
♦ Avalanche Rugged Technology
♦ Rugged Gate Oxide Technology
♦ Lower Input Capacitance
♦ Improved Gate Charge
♦ Extended Safe Operating Area
♦ 175°C Operating Temperature
♦ Lower Leakage Current: 10µA (Max.) @ VDS = 60V
♦ Lower RDS(ON): 0.050Ω (Typ.)
Absolute Maximum Ratings
Symbol
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
PD
TJ , TSTG
TL
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (TC=25°C)
Continuous Drain Current (TC=100°C)
Drain Current-Pulsed
(1)
Gate-to-Source Voltage
Single Pulsed Avalanche Energy (2)
Avalanche Current
(1)
Repetitive Avalanche Energy
(1)
Peak Diode Recovery dv/dt
(3)
Total Power Dissipation (TA=25°C) *
Total Power Dissipation (TC=25°C)
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8 from case for 5-seconds
BVDSS = 60 V
RDS(on) = 0.07Ω
ID = 17 A
D2-PAK I2-PAK
2
1
3
1
2
3
1. Gate 2. Drain 3. Source
Value
60
17
12
68
±20
149
17
4.4
5.5
3.8
44
0.29
- 55 to +175
300
Units
V
A
A
V
mJ
A
mJ
V/ns
W
W
W/°C
°C
Thermal Resistance
Symbol
Characteristic
Typ.
RθJC
RθJA
RθJA
Junction-to-Case
Junction-to-Ambient *
Junction-to-Ambient
--
--
--
* When mounted on the minimum pad size recommended (PCB Mount).
Max.
3.43
40
62.5
Units
°C/W
Rev. B
© 1999 Fairchild Semiconductor Corporation
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页数 | 7 页 | ||
下载 | [ IRFWZ24.PDF 数据手册 ] |
零件编号 | 描述 | 制造商 |
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