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PDF 61113 ( 数据表 ) |
零件编号 | 功能 ( 描述 ) | 制造商 | ||
6 | 61113-005 | GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE (2N2369AUB) 61113 Mii OPTOELECTRONIC PRODUCTS DIVISION Features: • • • Hermetically sealed Hermetically sealed 3 pin LCC MIL-P |
Micropac Industries |
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5 | 61113-004 | GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE (2N2369AUB) 61113 Mii OPTOELECTRONIC PRODUCTS DIVISION Features: • • • Hermetically sealed Hermetically sealed 3 pin LCC MIL-P |
Micropac Industries |
|
4 | 61113-003 | GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE (2N2369AUB) 61113 Mii OPTOELECTRONIC PRODUCTS DIVISION Features: • • • Hermetically sealed Hermetically sealed 3 pin LCC MIL-P |
Micropac Industries |
|
3 | 61113-002 | GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE (2N2369AUB) 61113 Mii OPTOELECTRONIC PRODUCTS DIVISION Features: • • • Hermetically sealed Hermetically sealed 3 pin LCC MIL-P |
Micropac Industries |
零件编号 | 功能 ( 描述 ) | 制造商 | |
ASJD1200R085 | Normally-ON Trench Silicon Carbide Power JFET |
Micross |
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BA6343 | Stepping motor driver |
ROHM |
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BM63 | Bluetooth 4.2 Stereo Audio Module |
Microchip |
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